Drop-in chuck
It is suitable for transporting wafers with warping or those that leak with a suction chuck.
It is suitable for transporting wafers with warping and those that leak with a suction chuck. This is a chuck for transporting wafers that can make contact with the back surface of the outer circumference and the edge. It utilizes a tapered guide to hold the wafer within a certain range by its own weight. Transporting wafers with contact restrictions from the outer circumference at an affordable price. By adding an optional substrate presence sensor, it allows for confirmation of the presence of the wafer (when used in the atmosphere).
- Company：ジェーイーエル
- Price：Other
